The new 6100+ chipset will offer premium features including sub-6GHz 5G network for mid-range mobile devices.
MediaTek has officially unveiled the Dimensity 6000 series along with the 6100+ chipset. The 6100+ chipset is set to deliver reliable Sub 6GHz 5G connectivity. On top of this, the chipset offers other premium features such as high frame rates, and exceptional power efficiency.
With the increasing roll out of 5G network across developing markets, there is a growing need for mid-range devices that offers next-generation connectivity. As a result, the new chipset seeks to cater for this need by making advanced 5G connectivity more accessible and with improved features.
The Dimensity 6100+ boasts of an enhanced 5G modem with support for the 3GPP Release 16 standard, with up to 140 MHz 2CC 5G Carrier Aggregation. Another impressive feature is the UltraSave 3.0 technology that reduces 5G power consumption.
The 6100+ chipset has two Cortex-A76 cores and six Cortex-A55 cores. The new chipset offers notable enhancements such as impressive imaging technologies with support for AI-powered cameras – up to 108MP and up to 2K 30fps video capture. The 6100+ supports powerful camera features includes AI-bokeh for “stunning portraits and selfies”. It also offers a premium 10-bit display support allowing more than 1 billion colors to be reproduced for vibrant images and videos along with support for 90Hz and 120 Hz frame rates for a smooth user experience.
The new Dimensity 6000 series joins the broad MediaTek’s 5G portfolio that expands across different price tiers. Other series include the Dimensity 9000 series designed for flagship phones, the Dimensity 8000 series for premium phones, the Dimensity 7000 series, and now the Dimensity 6000; the company has said, “The new Dimensity 6000 series will now democratize higher-end features to mainstream 5G devices.”
The first mobile devices to feature the Dimensity 6100+ chipset are expected to be available in the third quarter of this year.
