The MediaTek Dimensity 9300 is here. MediaTek claims it will offer “supercharged 5G System on a chip(SoC) features and will maximize smartphone performance & efficiency”. MediaTek has adopted a unique approach for its CPU, leveraging TSMC’s advanced third-generation 4nm process. In the case of the Dimensity 9300, it utilizes a configuration comprising four ultra-large cores and four big cores, aimed at maximizing raw processing power.
The MediaTek Dimensity 9300 outperforms the Snapdragon 8 Gen3 in terms of CPU and GPU performance, as well as energy efficiency. These findings were based on testing conducted on an engineering mobile phone. While further observations are necessary for the mass production of mobile phones, the initial results are quite promising. MediaTek indicates that the GPU exhibits a 23% performance increase compared to the Snapdragon 8 Gen 3 in assessments such as GFXBench Manhattan 3.1.
High-end smartphones users with devices running on the chip can anticipate unmatched gaming, video, and on-device generative AI processing. MediaTek claims the new chip will deliver high performance while “reducing power consumption by 45%”.
MediaTek has introduced enhancements to the Arm Immortalis-G720 GPU, now featuring 12 cores and delivering a 46% boost in ray-tracing performance. According to the company’s claims, it’s capable of managing “console-level” illumination effects while also conserving 40% of memory bandwidth.
The chipset offers good visual capabilities, supporting resolutions of up to WQHD at 180Hz and 4K at up to 120Hz. Additionally, it provides dual active display support, particularly beneficial for foldable phones. In terms of connectivity, the 5G R16 modem is seamlessly integrated, enabling 4CC-CA Sub-6GHz and 8CC-CA mmWave connections. It incorporates MediaTek’s UltraSave 3.0+ technology, enhancing 5G experience.
No US Launch For MediaTek Dimensity 9300
Although the current launch by MediaTek is quite exciting, the company was rather forthright when questioned about a U.S. release. In summary, a U.S. launch is not on the immediate horizon, but it is indeed expected in the Chinese and European markets. The Dimensity 9000 and Dimensity 9200 SoCs were relatively uncommon even in the European market, but if these chips are truly becoming competitive with Qualcomm, it’s possible that we may see them introduced sooner rather than later.
MediaTek has announced that the first devices will hit the market this month.
